Road Map Rigid Boards
Technology Road Map Rigid Boards
| Product Feature | Standard | SOA | Future |
| Inner Layer Line/space | 2.5/2.5 mil | 2/2 | 1.5/2 |
| Outer Layer Line/space | 3/3 mil | 2/2 | 1.5/1.5 |
| Layer Count | 40 | 40 | 40 |
| Min. Drilled Via-Mechanical | 6 mil | 5 mil | 3 mil |
| Min.Diameter Laser Drilled Microvia | 3 mil | 3 mil | 2 mil |
| Aspect Ratio Thru Hole | 1:12 | 1:14 | 1:16 |
| Aspect Ratio Blind Microvia | 1:0.8 | 1:1 | 1:1.5 |
| Min. Dielectric Thickness Core |
0.002” | 0.002” | 0.001” |
| Min. Via Hole Pad | 0.016” | 0.014” | 0.012” |
| Min. Microvia / Capture Target Land Size |
0.010” | 0.008” | 0.008” |
| Solder Clearance Mask | 0.0015” | 0.001” | 0.001” |
| Surface Finishes | ENIG; ENEPIG; imm Ag; Imm Sn; HASL Pb free;Electrolitic Au | ||
| Buried Passives | Yes | Yes | Yes |
| Impedance Tolerance | ±10% | ±7% | ±5% |
| Via in Pad Technology Fill & Plated | Yes | Yes | Yes |
| Microvia / Blind Via Fill | Yes | Yes | Yes |
