High-End PCB

Eltek Teflon (PTFE) Fusion Bonding

Benefits of the Teflon (PTFE) Fusion Bonding

* Homogenous multi-layer constructions using high performance materials.
* High electrical performance compare to other lamination methods. The same         

        Dk, Df for core and bond ply.
* Improved layer-layer registration as compared to MLB’s bonded using non-

        PTFE  prepreg or unfiled fluopolymer films.
* Excellent dielectric layer to layer adhesion.
* Highly reliable PTH structure.

Eltek Capability (Teflon) PTFE Fusion Bonding:
* Panel Size 12″x18″   Teflon (PTFE) based core Material
* Bond Ply and core to core Multilayer Stack
* High Thermal Stress Reliability

Test Eltek samples of Teflon (PTFE) Fusion Bonding, Rigid Board: Registration    

     After six Thermal Stress approve technology in compares to @IPC TM-650 2.6.8    

    Thermal Stress, Plated-Through Holes.

Materials: Rogers RT/duroid 5000, 6000