High-End PCB

HDI

 

Including buried and blind via holes.

 

  • MICROVIA
    • Less than 0.1 mm between layer 1 and 2.
    • Also available between layer 1 and 3,2 and 4,2 and 3,3 and 4.
    • Aspect ratio up to 1:1

 

  • Conductor trace – 3 mil
  • Space between conductor trace – 3 mil

 

hdi