Technology Road Map

Road Map Rigid Boards

Technology Road Map  Rigid Boards 

  Product Feature  Standard  SOA  Future
  Inner Layer Line/space2.5/2.5 mil2/21.5/2
  Outer Layer Line/space3/3 mil2/21.5/1.5
  Layer Count  40  40  40
  Min. Drilled Via-Mechanical6 mil  6 mil  6 mil
  Min.Diameter Laser Drilled Microvia  3 mil  3 mil  2 mil
  Aspect Ratio Thru Hole01:12  01:14  01:16
  Aspect Ratio Blind Microvia  1:0.8  1:1  1:1.5
  Min. Dielectric
Thickness Core
  0.002” 0.002” 0.001”
  Min. Via Hole Pad  0.016”  0.014”  0.012”
  Min. Microvia / Capture
Target Land Size
0.010”0.008”0.008”
  Solder Clearance Mask 0.0015”  0.001” 0.001”
  Surface Finishes ENIG; ENEPIG; imm Ag; Imm Sn; HASL Pb free; Immersion Tin; Immersion Silver;
  Burried Passives  Yes  Yes  Yes
  Impedance Tolerance  ±5%  ±5%  ±5%
  Via in Pad Technology Fill + Plate  Yes  Yes  Yes
  Microvia / Blind Via Fill  Yes  Yes  Yes