High-End PCB

HDI

 

Including buried and blind via holes.

 

  • MICROVIA
    • Less than 0.1 mm between layer 1 and 2.
    • Also available between layer 1 and 3,2 and 4,2 and 3,3 and 4.
    • Aspect ratio up to 1:1

 

  • Conductor trace – 3 mil
  • Space between conductor trace – 3 mil

 

hdi

Clients testimonials

This is what our clients say about us

"I like to thank Nistec teamĀ for the Vermentino layout.
You are all part of the great success!"

Tziony N.
March 6, 2014

"On behalf of our company, I wish to thank you and all the team for the wonderful work you do for us in general and during last month in particular. "
Asaf C.
January 2, 2014

"Their GREAT work, cooperation, commitment and loyalty to bring the G.hn project in super fast delivery."
Guy H.
July 17, 2013

"It was a pleasure, the service, the quality and the highest level skill was wonderful."
Thomas F.
November 12, 2014