Technology Road Map

Road Map Flex-Rigid Boards

Technology Road Map Flex-Rigid Boards

 Product Feature  Standard   SOA  Future
Inner Flex Layer line/space 2.5/2.5 mil 2/2 1.5/2
 Rigid Inner Layer line/space 2.5/2.5 mil 2/2 1.5/2
 Rigid Outer Layer line/space   3/3 mil 2.5/2.5   2/2
 Min. Dielectric Thickness of Flex Layer 0.001” 0.5 mil 0.5 mil
 Min.Base Copper Thickness Flex Layer 9 µ 5 µ 5 µ
Layer Count Multiflex 10 12 12
Layer Count Flex-Rigid 28 32 34
 Min. Via Hole Size Mechanical Drilled   0.006″   0.006″   0.005″
 Min. Microvia Laser Drilled Flex Layer   0.003″   0.003″   0.002″
 Coverlay +  Adhesive   1 mil   1 mil   1 mil
 Coverlay Phoimageable Yes  Yes  Yes
Silver Shielding Yes Yes Yes

Clients testimonials

This is what our clients say about us

"I like to thank Nistec team, especially Svetlana -
for the Vermentino layout. You are all part of the great success!"

Tziony N.
March 6, 2014

"On behalf of our company, I wish to thank you and all the team for the wonderful work you do for us in general and during last month in particular. "
Asaf C.
January 2, 2014

"Their GREAT work, cooperation, commitment and loyalty to bring the G.hn project in super fast delivery."
Guy H.
July 17, 2013

"It was a pleasure, the service, the quality and the highest level skill was wonderful."
Thomas F.
November 12, 2014